Hardware:Camera Module
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Contents |
Overview
This page provides information on the BUG 2.0 camera hardware and a catalog of files which provide detailed hardware specs for anyone who needs them.
Board Details
BOARD NAME : camera PIM (MFY100195200503) REV : C DIMENSIONS : 60.23 MM X 60.23 MM NO.OF LAYERS : 6 MINIMUM TRACEWIDTH/ CLEARANCE : 5/5 MILS MINIMUM DRILL SIZE : 12 MILS BOARD THICKNESS : 1.6 +/- 10% MM
Files
- Camera Schematics: File:BUGLABS CAMERA PIM SCH 2.05.pdf
- Bill of Materials: File:BUGLABS CAMERA PIM BOM.xls
- Load Switch Specs: File:FPF2125.pdf
- CMOS Camera Module: File:LI-3M02CM Specification.pdf
- Reset Circuits: File:MAX6340-MAX6426.pdf
- SOC Digital Image Sensor: File:Mt9t111 ds e Public.pdf